Contamination Control Where Yield Depends on It

The Challenge

At sub-micron geometries, a single particle can kill a die. Electronics cleanrooms must control not just particles but molecular contamination, electrostatic discharge, temperature stability and vibration — simultaneously and continuously.

What We Deliver

• Wafer fab and photolithography areas (ISO Class 1–5)
• SMT and electronics assembly lines (ISO Class 7–8 with ESD control)
• Electrically conductive (ESD-safe) panels, flooring and workstations
• AMC (airborne molecular contamination) control strategies
• Temperature and humidity control to ±0.1 °C / ±1% RH where required

Key Technical Capabilities